File:IBM Broadway with heat spreader.jpg
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Summary
| Description |
English: An illustration of IBM's processor for Nintendo's Wii, called Broadway. This is the first variant, manufactured on a 90 nm copper SOI process in week 39 of 2006 mounted on a organic ball grid array substrate, with a heat spreader on it. Inspiration for the image comes from numerous pictures on the Internet, IBM, Nintendo and privately owned photos. |
| Date | |
| Source | Own work |
| Author | Henriok |
Licensing
I, the copyright holder of this work, hereby publish it under the following license:
 
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This file is made available under the Creative Commons CC0 1.0 Universal Public Domain Dedication. |
| The person who associated a work with this deed has dedicated the work to the public domain by waiving all of their rights to the work worldwide under copyright law, including all related and neighboring rights, to the extent allowed by law. You can copy, modify, distribute and perform the work, even for commercial purposes, all without asking permission.
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| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 15:33, 22 July 2015 | | 1,488 × 1,488 (845 KB) | Henriok | User created page with UploadWizard |
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